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產品名稱:F300 AutoPod™ Wafer Carrier 晶圓承載盒
產品名稱:F300 AutoPod™ Wafer Carrier 晶圓承載盒 | 點閱次數:1989 | 加入時間:2007/4/15 下午 10:30:28
圖片簡介:
Entegris F300 AutoPod™ Wafer Carrier 晶圓盒 The F300 incorporates a variety of features to provide reliable automation interface and interoperability:   • The F300 AutopodR conforms to SEMI standards E47.1 and E1.9.   • Precise 10mm wafer spacing with accurate and reliable wafer plane   • 142mm square top robotic lifting flange   • Lower side conveyor rails   • Kinematic coupling plate   • Configurable A, B, C or D info pads for product segregation   • FIMS interface two-key door 
Specifications
 • Overall size:    Depth: 344mm (13.5")    Width: 430mm (16.9") handle to handle    Height: 332mm (13.1")   • Wafer Spacing: 10mm   • Weight without wafers: 4.5 Kg (10 lb)   • Weight with wafers: 7.69 Kg (17 lb) 
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