產品名稱:Bare Die/CSP Trays 盤 | 點閱次數:2496 | 加入時間:2006/9/29 下午 05:55:00 圖片簡介: It offers the world's most comprehensive IC Packaging delivery systems for bare die, CSP, opto electronics and other microelectronic devices. Tray Wizard. Search from our database of over 10,000 different and existing H20 series (2" square) and H44 series (4" square) trays to fit your specific application. Accessories. Select from a variety of complementary accessory items such as covers, clips, inserts and storage boxes that make shipping your die easy and convenient. Tray Material Technical Data. View technical data for materials used in our bare die/CSP trays. i-Tray™ Designer. Interactive, on-line design tool for your custom tray application. A product drawing and quotation are generated on-line and can be purchased on-line or emailed to your purchasing group for ordering. Custom Tray Request. Electronic form for requesting your custom tray needs. Request is submitted to factory for quote. Package Type and Family Tray Available : QFN (Quad Flat / No Lead) or MLF (Micro Lead Frame) BGA (Ball Grid Array) CQFP (Ceramic Quad Flat Pack) MQFP (Metric Quad Flat Pack) PGA (Pin Grid Array) PLCC (Plastic Leaded Chip Carrier) PQFP (Plastic Quad Flat Pack) also known as BQFP (Bumper Quad Flat Pack) TQFP (Thin Quad Flat Pack) with 1.0mm body height LQFP (Low Quad Flat Pack) with 1.4mm body height TSOP (Thin Small Outline Package) Type I & II CLDCC (Ceramic Leaded Chip Carrier)
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